Features:
It can withstand high temperatures of 300 degrees Celsius in a short period, and can withstand high temperatures of 250 degrees Celsius. With a high tensile strength of over 35% and high peel strength of 5N/25mm, it can be used for a long time as a heat resistant adhesive tape. High thermal insulation ensures your safety. Uses a special adhesive that has strong adhesion, so it will not leave any residue when removed. 33m x 0.55mm size is an excellent thermal adhesive tape for welding BGA chips.

Specifications:

• Product Type: -Thermal Adhesive Tape. 0.06mm
  
• Length: Approx. 33m
  
• Elasticity: ≥35%
  
• Release strength: 5N/1 in (25 mm)
  
• Tensile Force: 135N/25mm
  
• Heat resistance: Long duration: 250℃; Short time: 300℃
  
• Width: 20mm